Laser Microchannel Engraving Technology
Precision Laser × DUV Femtosecond Laser × Laser Interference × iLORA
Integrated Microchannel Cooling Technology Platform
MOL Solutions integrates precision laser machining, DUV Femtosecond Laser (Deep Ultraviolet Femtosecond Laser), Fusion Bionics laser interference surface engineering, and iLORA optical inspection into the microchannel cooling process. Each technology respectively handles microchannel shaping, fine structural machining, large-area high-speed surface functionalization, and non-contact quality verification—establishing a comprehensive technology platform from processing to inspection.
Precision laser machining is primarily used to fabricate the overall microchannel geometry, including main channels, branch channels, manifolds, serpentine flow paths, inlets/outlets, and localized hot-spot cooling zones. By combining Beam Shaping, Galvo Scanners, and high-precision motion platforms, channel width, depth, pitch, and flow resistance can be customized according to chip thermal distribution to rapidly establish tailored cooling structures.
DUV femtosecond laser processing is ideal for smaller-scale, higher-precision microchannel inlets, micro-jet nozzles, flow restriction structures, and high-density micro-hole arrays. Short DUV wavelengths produce finer focal spots, while ultrashort femtosecond pulses achieve material ablation before heat diffuses to surrounding areas—effectively minimizing Heat-Affected Zones (HAZ), recast layers, chipping, and subsurface micro-cracks. This capability is uniquely suited for hard and brittle substrates such as SiC, glass, sapphire, and advanced ceramics.
The pivotal advantage of Fusion Bionics laser interference technology lies in its ability to rapidly generate large-area micro/sub-micron structures through "parallel processing." Conventional single-beam lasers rely on point-by-point or line-by-line raster scanning, where each pulse processes a limited localized area. When millions of microstructures are required across microchannel floor surfaces or entire cooling substrates, processing time increases significantly with structure count and surface area.
Laser interference technology utilizes two or more coherent laser beams to generate periodic high- and low-energy distribution patterns. A single exposure simultaneously creates massive, highly ordered structures, which are continuously transferred across larger processing areas via high-speed scanning. Consequently, throughput is not limited by crafting individual micro-grooves or micro-pillars sequentially; instead, multiple micro-features are realized at once within the interference light field, dramatically boosting large-area surface modification speeds and processed area per unit time.
This capability is particularly suitable for high-speed functionalization of open microchannel floor surfaces, cooling lids, SiC substrates, and large-area heat sinks prior to packaging or bonding. Beyond speed advantages, the interference light field dictates structural periodicity optically, ensuring superior consistency in Pitch, Orientation, and Geometry while mitigating seams, pitch deviations, and overlap irregularities common in long-distance raster scanning.
By adjusting beam intersection angles, polarization, energy, and scanning directions, structures such as Grooves, Grids, Dot Arrays, Pillars, or Lattices can be formed across large-area channel surfaces. Micro-grooves aligned with flow direction guide coolants and accelerate rapid filling; crossed structures, dot arrays, and micro-pillar arrays increase effective heat transfer area, induce localized fluid mixing, and disrupt thermal boundary layers—enabling low-temperature coolants to contact high-temperature surfaces more effectively.
Laser interference also enables large-area hydrophilic or hydrophobic functional surfaces. Hydrophilic structures accelerate coolant spreading and filling inside channels; selective wetting structures regulate fluid direction, bubble migration, and venting pathways—reducing risks of bubble entrapment, localized dry-out, and non-uniform cooling.
iLORA conducts high-speed, non-contact optical scans over microchannels and Micro Pillar arrays, leveraging reflection signals to identify height deviations, structural deformations, missing features, edge chipping, surface damage, and micro-cracks. Inspection results can be correlated with laser energy, focal position, and scanning parameters to establish a foundation for process compensation and closed-loop control.
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